Packaging producers, suppliers and technology developers are set discuss the future of the packaging supply chain this summer at the first ‘Packaging & Label Forum‘, a new event from Esko in association with some of the biggest names in the sector.
From 7-8 June 2023, the two-day event will give packaging and label professionals the opportunity to network with suppliers from across the industry, to participate in open mic sessions, to share and learn tips and tricks, receive expert technical advice, and hear from industry leaders and keynote speakers. Held at Holywell Park, Loughborough, the inaugural event will include presentations and speakers from companies including HP, CERM, DuPont, Asahi, GMG, AV Flexographic and more.
Registration for the two-day event is free, with complimentary lunch and coffee. On the evening of 7 June, subject to availability, there will also be a complimentary dinner and live band entertainment. To register for the free event (maximum two representatives per company) just visit this site.
