NAPCO enhances digital packaging capabilities with Highcon

Highcon has announced at drupa, that NAPCO, has purchased a Beam 2 digital die cutting system for its Sparta packaging facility in North Carolina, USA.

The Highcon system is set to be shipped after drupa. NAPCO has been in the packaging industry since 1977 and has always been quick to adapt to changing trends in the market. By integrating Highcon’s digital die-cutting technology into their digital printing workflow, NAPCO has taken a significant step towards optimizing production agility and expanding its market reach.

Rob Proffit, President of NAPCO USA, said, “Eliminating the need for physical dies will significantly lessen the turn-time from order to delivery. It also allows unlimited structural creativity and design. As an extension to our existing digital packaging equipment, the Highcon will expand our current reach into digital finishing, broadening our range of products into other categories.”

Joe DeBoy, VP of Sales, NAPCO USA, added, “Today’s customers require cost-effective, customizable, quick-turn solutions. The Highcon delivers on all of this. With no tooling and quicker lead-times, this piece of equipment will allow us to capture most of the digital manufacturing we were losing previously. We’re very excited about the opportunities the Highcon will allow us to go after.”

Join our Newsletter

Sign up to our weekly newsletters for updates on articles, interviews and events

Sign up