Hybrid Software is set to host the ‘Hybrid Fusion Packaging Summit 2025‘. Taking place in Amsterdam, this three-day summit will bring together global industry leaders for an exclusive opportunity to learn, exchange ideas, and gain practical insights on driving operational efficiencies, embracing digital transformation, and meeting sustainability targets.
The event will be held at the NH Collection Amsterdam Barbizon Palace from April 22-25, 2025. It promises to be a great experience with a full agenda designed to empower attendees through interactive sessions, keynote speakers, and networking opportunities. The program will be available in French, German, Italian, and Spanish to accommodate an international audience.
‘Hybrid Fusion Packaging Summit 2025’ will feature an array of activities, including a river boat cruise along the picturesque canals of Amsterdam and an elegant Gala Dinner.
The event is co-sponsored by Arden Software, HP, ECO3, ABG, AV Flexologic, Bobst, CERM, Conics, Global Vision, Infigo, Koenig & Bauer, and XSYS, with highly relevant keynote addresses by Marco Boer and David Zwang.
The summit will include factory visits to three Hybrid Software customers and partners – Geostick, Intergrafipak, and AV Flexologic – who will share their facilities for the production of labels, folding cartons, and mounted flexo printing plates.
Guido Van der Schueren, Chairman, Hybrid Software, explains, “In today’s fast-evolving landscape, businesses must continuously assess their workflows, embrace digital transformation, and leverage innovative tools to remain competitive. We are excited to offer the Fusion platform for our customers, resellers, and partners to engage, share insights, and explore ways to streamline their operations across the packaging value chain.”